LCY Launches Advanced Materials Platform for Semiconductor Wet Processes, Delivering Solutions from Hydrocarbon Polymers to Fluorine-Free Colorless Polyimide

Group Photo of LCY Distinguished Guests (from left to right): Fang Chien-Chih, Deputy General Manager of Electronic Materials Division; Hsiao Yu-Ling, Chief Technology Officer; Liu Wen-Long, General Manager; Chao Fan-Ming, Senior Deputy General Manager of Electronic Materials Business Division and Senior Deputy General Manager of Excellence Operations Division; Ku Shu-Chieh, Deputy Spokesperson.

As the global semiconductor industry enters a new phase where device scaling and advanced packaging advance in parallel, the demand for higher material performance, safety, and sustainability continues to rise. The need for high-purity, customer-specific, and scalable materials has reached unprecedented levels, underscoring the growing importance of wet process formulations. Today, LCY Chemical Corporation (hereafter "LCY") unveiled "LCY Advanced Formulations," offering an early preview of the company's key technologies and sustainability advantages that will be highlighted at the Heterogeneous Integration Global Summit (HIGS) during SEMICON 2025. Specifically designed for advanced packaging applications that require high levels of integration and precision, these formulations deliver three core advantages, superior cleaning performance, high safety standards, and sustainable innovation, providing global customers with a critical solution that combines technological depth with process stability to fully support worldwide capacity expansion.

Semiconductor manufacturing has entered an era of extreme precision, where cleaning materials have evolved from a supporting role to a decisive factor in yield and process performance. Building on years of proven expertise in the development, reliable supply, and recycling of electronic isopropyl alcohol, LCY has launched its new wet process solution for semiconductor manufacturing "LCY Advanced Formulations." This next-generation platform integrates three core strengths: technological foresight in electronic materials, advanced process applications with customization capability, and a sustainability-driven circular approach. By combining R&D, application testing, and mass production support, LCY further enhances the resilience of the global electronic materials supply chain. Looking ahead, the company will collaborate with customers to drive innovation in process materials from the very front end of manufacturing, meeting the stringent requirements of ultra-high purity and stability, and empowering the semiconductor supply chain with a new level of competitiveness.

LCY newly launched semiconductor wet process solution, LCY Advanced Formulations, is designed to support a wide range of applications, including wafer cleaning and post-packaging cleaning. It delivers exceptional performance, selectivity, and process compatibility to meet the exacting demands of advanced semiconductor nodes.

(From left to right): Liu Wen-Long, Hsiao Yu-Ling, Ku Shu-Chieh of LCY delivered speeches.

At the same time, LCY is actively advancing its ESG commitments. The company was recognized by Taiwan Semiconductor Manufacturing Company (TSMC) with the "2024 TSMC Excellent Performance Award – Green Manufacturing", and was also named a 2024 CDP (The Carbon Disclosure Project) Supplier Engagement Leader, earning the highest rating of A. LCY has set a clear target of reducing its total corporate carbon emissions by 42% by 2030. Within its Electronic Materials department, LCY has committed to adopting 85% renewable energy at its Taiwan plants (Linyuan and Central Taiwan Science Park plants) and 100% renewable energy at its China plants by 2030, reinforcing its vision to achieve net-zero emissions by 2050.

According to a report by semiconductor research firm Knowledge Sourcing Intelligence, the wet process formulations market is experiencing rapid growth, driven by the rising demand for higher purity and precision in cleaning solutions enabled by advanced packaging technologies such as 3D IC, fan-out packaging, and system in package (SiP). The market is projected to expand from USD 2.993 billion in 2025 to USD 4.109 billion¹ by 2030. Amid the global AI-driven capacity expansion, LCY will continue to invest in the development of advanced cleaning materials and application technologies, while deepening strategic collaborations with foundries, outsourced semiconductor assembly and test providers (OSATs), and equipment manufacturers. These efforts are aimed at strengthening LCY's global presence and positioning the company as a long-term, reliable partner in advanced semiconductor processes and electronic materials, supporting customers in capturing new opportunities arising from technology node transitions.

Reference: 
¹Knowledge Sourcing Intelligence Semiconductor Packaging Cleaning Chemicals Market - Forecasts from 2025 to 2030

1. LCY Advanced Formulations – Semiconductor Wet Process Solutions

LCY Advanced Formulations LCY Advanced Formulations is a next-generation series of wet process solutions developed by LCY specifically for advanced packaging and high-precision semiconductor manufacturing. Designed to enhance both process efficiency and yield, the formulations are engineered with a dual focus on environmental sustainability and operational safety. Rigorously validated through commercial-scale testing, the solutions deliver superior cleaning performance, effectively removing post-etch photoresist, copper pillars, and temporary bonding materials from wafer surfaces. This ensures higher yield, greater process stability, and seamless integration into critical cleaning steps across advanced packaging process.

2. Fluorine-Free Colorless Polyimide (CPI)

LCY has developed a fluorine-free Colorless Polyimide (CPI) tailored for advanced displays, automotive displays, and flexible electronic devices. Designed to deliver exceptional mechanical strength, thermal stability, and optical performance, CPI aligns with the global trend of phasing out PFAS (per- and polyfluoroalkyl substances). Featuring high transparency and low optical retardation, this material combines flexibility with durability, enabling large-scale and robust applications. With its unique performance profile, CPI is positioned to replace traditional glass cover plates as the next-generation core material for flexible electronics. 

3. Advanced Hydrocarbon Polymer Series

The Advanced Hydrocarbon Polymer Series is developed by LCY to meet the demanding requirements of high-speed copper-clad laminates (CCL) used in next-generation applications such as AI, autonomous vehicles, servers, and data centers. The series includes liquid rubber and ultra-low dielectric loss resins. These materials feature low dielectric loss, thermal stability, high solubility, and excellent toughness, enabling high-speed transmission and long-term reliability to support the stringent performance needs of advanced high-frequency and high-reliability electronic systems.